半導體工藝工程師

The Role’s Critical Responsibilities:
This role is responsible for providing day-to-day engineering support for manufacturing operations, as well as implementing yield, process and product improvements.
Essential Function：
1. Development of innovative processes for the production of AMB substrates and DCB substrates as well as maintenance and further development of existing processes
2. Focus: wet chemical processes (chemical Ag, Ni, Au coating, cleaning, surface characterization, solderability and wire bondability of substrates, solder resist, qualification of packaging)
3. Analysis of existing manufacturing processes and identification of innovation ideas
4. Ensuring / maintaining process stability in ongoing production
5. Support in procurement of production facilities
6. Accompaniment and support of R&D projects from the feasibility phase through the sample phase to suitability for series production
7. Planning, implementation and evaluation of tests and transfer of the results to production including implementation of process capabilities
8. Implementation of internal projects in cooperation with product development, manufacturing, quality assurance, marketing and sales
9. Ensuring and continuously improving product quality, reducing costs and rejects
10. Other work assigned by supervisor.
Required：
1. Education: B.E. in process / chemical /materials engineering.
2. Knowledge of wet chemical processing (printed circuit board production or comparable disciplines) for the processing and treatment of metallic materials is beneficial).
3. Minimum 1 years of experience in process engineering in a manufacturing environment (preferably automotive).
4. 8D Knowledge (root cause analysis, Ishikawa, 5 Why) & Hands-on mentality
5. Potential ability in English (spoken & written)
Preferred：