2.At least 3 years of process development or maintenance experience in Dry Etching or DRIE (Deep Reactive Ion Etching) area.
至少3年干法蝕刻或深硅刻蝕（DRIE）的工藝開發或維護經驗。
3.1Familiar with Dry Etching related process and measurement (equipment operation and recipe editing).
熟悉干法蝕刻相關的工藝和測量（包括設備操作和菜單編輯）。
4.Familiar with the configuration and working principle of the Dry Etching platform, and could independently create, modify, and optimize the process recipes.
熟悉干法刻蝕平臺的配置和工作原理，能獨立創建、修改、優化工藝菜單。
5.Hands-on ability at dry etching.
較強的干法刻蝕的動手能力。
6.Proficient in office software such as Excel, PPT, etc.
熟練使用Excel、PPT等辦公軟件。
7.Fluent English speaking and writing skill.
流利的英語聽說讀寫能力。
8.Experience in process development in 8-12 inch Fab is preferred.
有8-12英寸工廠工藝開發經驗者優先。