Responsibilities and Main Tasks:
1. Lead process & product development projects, ensuring alignment with strategic goals and timely execution.
2. Provide work packages comprehensive technical risk assessments, development timelines, and resource planning for new projects or concepts initiated by AE (application engeneering).
3. Prepare and coordinate detailed reports and documentation to facilitate effective knowledge transfer for both internal and external stakeholders. Ensure all tasks, open items, and qualifications are completed prior to project closure.
4. Configure and maintain multiple projects within the AT&S project management tool, ensuring real-time updates to project content and status. Conduct regular evaluations of project risks—including technical, scheduling, resource, and support risks—and escalate issues when necessary.
5. Continuous consultation with manager about relevant tasks within department, solve technical difficulties.
6. Effective Communication: strong relationships built through clear, respectful interactions with both internal teams and external stakeholders.
7. Set priorities and assure execution of commitments.
8. Take lead and authorize for decision justification for cross department deal on new projects or given tasks.
9. Authority of giving technical guide and report review for team subordinate.
10. Involvement in invention disclosure idea sharing or submission.
Requirement:
1. Technical science background for instance chemistry, material science, electronic or semiconductor background, either HTL/ Bachelor with experience or Master degree.
2. Basic knowledge of quality standards (ISO/ IATF16949).
3. Familiar with quality tools like SPC, MSA, FMEA, PPAP, APQP…
4. 3 years of experience in/as a Senior process engineer in related PCB industry, more than 5 years’ experience in litho or plating process (HDI&msap). Or similar experience in other companies, depended on performance & competence and several years of professional experience in PCB or Semiconductor industry. Familiar with Impedance methodology and improvement method.
5. Experience in high layer counts manufacturing and AI server related development will be an added advantage.
6. Good communication and negotiation skills. Basic knowledge of quality standards (ISO/ IATF16949).
7. Familiar with quality tools like SPC, MSA, FMEA, PPAP, APQP…
8. Leadership, interpersonal skills and effectively communicate with a wide range of individuals.
9. Fluent written and oral English (Mandarin is an advantage).
10. Integrated and interdisciplinary thinking and acting.
11. Self-motivating ability to foster a cooperative work environment.
12. Assertiveness, stress resistant, experience in leadership of intercultural teams.
13. Willingness to travel and stay abroad for certain period.
14. Good analytical skills with meticulous attention to detail.
Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes.
一旦向招聘公司投遞簡歷,即視為應(yīng)聘者同意招聘公司基于招聘目的而對其簡歷和其他個(gè)人信息進(jìn)行收集、處理、使用和披露等。
其他信息